Press information To download a 300dpi print quality image, go to www.parkfield.co.uk/bvm/HS-771_print.jpg Half-size SBC packs a full size punch Released 06 March 2009 The powerful new HS-771 SBC from BVM is a half size (185 x 122mm) PCI card form factor unit that is ideal for embedded applications where physical space is at a premium. Despite its compact size, the SBC supports Socket P pin-out processors such as the Intel Core 2 Duo Mobile Penryn or Core 2 Extreme with a FSB up to 1066 MHz addressing up to 4GB of RAM. The Mobile GM45 Express chipset provides excellent flexibility and performance for developers of embedded applications such as network appliances, gaming platforms and industrial automation equipment, with outstanding graphics, memory and I/O bandwidth, asset management capabilities, storage speed and reliability. The integrated Mobile Intel Graphics Accelerator 4500MHD and Intel Clear Video Technology with graphics core speeds up to 533MHz provide enhanced graphics and 3D rendering performance and enable high-definition video playback; the unit supports numerous display types including VGA, DVI, LVDS and HDTV. The integrated audio interface is powered by the ICHM-9 chipset. Extensive internal and external I/O capability is provided: four x 300MB/s SATA interfaces, two x Gigabit LAN ports, eight x USB 2.0 ports, one RS232 and one RS485 ports, a Mini-PCI and a PCI Express Mini card socket. System management functions include an 8-bit GPIO programmable interface and a 256-level watchdog timer. *** Ends: body copy 213 words *** Notes to Editors. Technical and sales contact for publication: David Harding BVM Limited Hobb Lane Hedge End Southampton SO30 0HG t: + 44 (0)1489 780144 f: + 44 (0)1489 783589 sales@bvmltd.co.uk www.bvm.co.uk Editorial contact: Rod Clarke t: + 44 (0)1489 780144 rod_c@bvmltd.co.uk Agency contact: Nigel May Parkfield Communications Ltd Parkfield House Damerham Hants SP6 3HQ t: + 44 (0)1725 518321 f: + 44 (0)1725 518378 nigel.may@parkfield.co.uk www.parkfield.co.uk